ASM Pacific Technology History

1975 Founded in 1975 as the Asian marketing arm of its Netherlands-based parent, ASM International N.V.
1980 Acquired ASM Assembly Automation, a manufacturer of semi-automatic wire bonder and a stamped leadframe operation.
1984 ASM Pacific Technology Ltd. developed and marketed its own fully automatic wire and die bonder machines, and also the trim and form machines.
1989 ASM Pacific Technology Limited was formally listed on the Hong Kong Stock Exchanges on January 2, 1989. The first China plant located in Shenzhen was established to manufacture parts and subassemblies. Subsequently, the leadframe stamping operation was extended to the same location in China.
1990 Part of the R&D center was extended to Singapore. ASM Singapore was established to manufacture gold wire bonders as well as other equipment such as automold and in-line solutions for factory automation. Etched leadframe operation was subsequently added into the manufacturing plant.
1994 ASM became the 5th largest Semiconductor Assembly and Packaging Equipment Manufacturer in the world.
1998 ASM's AB339 gold wire bonder won the Semiconductor International Editor’s Choice Best Product Award in recognition of its leading-edge technology in 50-micron pad pitch bonding capability.
1999 ASM became the 3rd largest semiconductor backend equipment manufacturer in the world and received the "1999 Technological Achievement Award" from the Hong Kong Government and the "Technology Achievement Award" from the NSTB Singapore.
2000 ASM expanded its production capacity in China and became the 2nd largest semiconductor backend equipment manufacturer in the world.
2001 ASM obtained the "Manufacturing Head Quarters Award" from the Singapore Government.
2002 ASM PT surpassed the long-time industry leader to become the Champion of the Assembly and Packaging Equipment Manufacturers in the world. Another enhanced gold-wire bonder model Eagle60 with 20% higher output and operating capabilities was launched.
2003 Maintaining its leadership in the semiconductor assembly and packaging equipment industry, ASM PT made further inroads in market share gain. ASM Pacific Technology Ltd. was selected by Advanced Packaging magazine as the Winners of the 2003 Advanced Packaging Awards, in the categories of: Wire Bonding, Encapsulation and Package Handling.
2004 2004 was an exciting year for ASM PT. It marked the launch of Eagle60AP wirebonder that takes wire bonding technology to a higher level with breakthrough in fine pitch bonding and looping control that offers the state-of-the-art technology to meet new packaging challenges. ASM has been consistently voted as one of the Best Suppliers for five years in a row, an award given by VLSI Research which is the leading research organization covering the semiconductor equipment and materials arena.
2005 In 2005, ASM PT celebrated its 30th Anniversary.
2007 ASM PT was ranked 8th Best Managed company in Hong Kong in Asia's Best Companies Poll by FinanceAsia in June. In the same poll, ASM comes in the Top 10 position in terms of Best Investor Relations and is also positioned in the Top 5 Most Committed Company to a strong dividend policy. ASM is also in the Top 3 placing in the Best Mid-cap category.

ASM Technology China, an R&D centre, was launched in Chengdu. This centre will further enlarge our R&D team to innovate new products for our customers.
ASM has been awarded by ASIAMONEY for Overall Best Managed Company in Hong Kong - Medium-Cap 2007.

2010 ASM Technology Huizhou, China, has gone into operations in August.

ASM PT has officially concluded its acquisition of the Siemens Electronics Assembly System (SEAS) Business from Siemens AG on 7th January. The SEAS team, with its approximately 1,200 members worldwide, is integrated into the ASM PT group as a business unit under the name “ASM Assembly Systems” (“ASM AS”).
ASM Technology China has shifted into our newly built R&D Hub in November.


ASM PT added DEK, a leading manufacturer of industrial printers. Together with the SIPLACE Team, both teams now form the SMT Solutions segment, ASM Assembly Systems.